Medical electronic miniaturization packaging and Assembly technology (1)

At a recent third China International Medical Electronics Assembly (CMET2010) craft workshops, Flextronics headquarters technical department, Senior Vice President Dr. East to shangguan armored medical electronic miniaturization packaging and Assembly tech "fascinating lecture was published, and medical electronics, especially in the portable, home-like medical electronics manufacturing process technology and the audience for the interactive discussion.

Product miniaturization technology is already in other products — such as mobile phones and other consumer electronics products — which already have years of experience in the development and application, the related experiment also has a number of years of history.

Technology workshops at CMET2010, doctor of medicine shangguan East armored Flextronics has many years of experience in medical device miniaturization technology among applications.

Flextronics Assembly capacity

You can apply to the medical device, microelectronic packaging technology.

For example, integration, including semiconductor Silicon Integrated SoC and system integration (System in Package), there are also 3D packaging and so on. As well as the Assembly has less than 8 mm, or 0201, 01005 components assembled, 3D packaging, flexible circuit board Assembly, etc., in terms of the means by which the Board level or you can reach the miniaturization of products.

Medical electronics can be used to encapsulate the miniaturization and Assembly technology

Specifically, to 0201, 01005 components Assembly, for example, now this technology has been applied in consumer electronics for five years, but among the medical electronics has not been widely used, because it involves micro devices in the process is relatively high requirements: If components, PCB's request, the flatness of the devices, the requirements of the printing process, and so on.

As well as the need to consider the design and manufacture of detection, as well as after the last repair and so on. Therefore you also need to do some work before the application of this technology in the medical device. 01005 mainly module application, the basic process is very similar and 0201, but to further refine the process, for example, paste the selection, you may want to use when welding to nitrogen, repair may be very difficult, and so on.

Flip Chip also has many types, such as Solder Bump you to 150 Micron, Flip Chips to be achieved in the application of the product have many things to do, what are the requirements for equipment, what are the requirements in terms of technology, and so on.

Fluxing because the spacing is fine, so using Flip Chip is difficult, there are also required to nitrogen Reflow. Nitrogen is not a must to get 50 PPI. More with Au Stud Bump, in order to further miniaturization, the simplest way is Au Stud Bump.

Some other approaches, such as integrated SOC and SIP also has a lot of discussion.

When to use when using the SOC, SIP some controversy. SOC General is relatively mature products, mature design, mature market. Because of SOC of high cost, only bulk application has the advantage. SIP generally used in the product and new technology applied, because it's cost is relatively low, and achieve faster, more suitable for a new product, new technology.