Recently, the China semiconductor industry association, China electronic material industry association, China electronic equipment industry association, China electronics news, common recognises "at its fourth session (2009) China semiconductor innovation products and technologies," 36 projects.
China electronics technology group Corporation Institute for research and development of the first 45 SSJ-100 ultrasound scanning microscope won this award.SSJ-100 ultrasound scanning microscope is an offline detection and analysis device, failure analysis, process development, critical production processes of monitoring and inspection of small-volume products have a great advantage, filling the domestic blank, and in all types of ultrasonic image construction and analysis, ultrasound emission receivers, focused bearing disc devices, and other aspects have related patent and proprietary core technologies.
The product can be used for all types of semiconductor device package such as BGA and QFN, FlipChip, CSP, MCM, internal injuries and discontinuities and other flaws in non-destructive testing and Visual analysis, and can be used for internal non-destructive testing of MEMS, manufacturing process of analysis, as well as ceramics, glass, metal, plastic and other materials characteristics, features and analysis. Relative to the x-ray NDT, ultrasound scanning microscope can complete reflect internal bonding layers, device the backfill layer, layer, and internal defects, as non-destructive testing of next generation technology, it has an irreplaceable advantage. It is a good technical support to solve problems for users, and similar foreign products of competitive bidding in the user's recognition, subject to a large number of users. The products are not only technically become users a reliable guarantee of product production, but also really reduces the production costs of domestic users.
No comments:
Post a Comment